By a specific electro – chemical process, the smoothness of cutting walls is provided to be smaller then one micron. The smooth surface makes separation of cream solder and stencil easier. Through this process, sieve cleaning period, which is need during the stencil production, is significantly lengthened.
Also with this process, the micro-burrs, which are occurred during the cutting, are cleaned. As a result, quality of printing is increased and a smooth, shiny and easy clean surface is provided.