Process

Parameter

• Polyimde Film 

• 0.5 mil, 1 mil, 1.5 mils, 2 mils

• Material

• Polyimide / Polyester

• Copper Foils Thickness

• 18 – 70 µCu

• Plating

• Tin – unleaded, Nickel, Gold

• Tape Fittings 

• Pressure Sensetive Adhesive (PSA)

• Number of Layers 

• 1 – 2

• Minimum Trace and Space 

• 3 mil & 3 mil (1 oz copper)

• Smallest Drill Size 

• 0.2 mm

• Min. Annular Ring Widht

• 4 mils

• Total Thickness of Part 

• 45 – 300 µCu

• PTH Wall Copper Thickness

• 0.025 mm

• Flexibility

• R=7, 180° , No broken crease (single panel) at time bending

• Hole Dia. Tolerance (PTH)

• +/- 0.05 mm

• Hole Dia. Tolerance (NPTH)

• +/- 0.08 mm

• Outline Tolerance

• +/- 0.1 mm